Sealed bids for the 2026 Chip Seal Program are due by May 14, 2026.
Official courthouse record · Indexed in NoticeRegistry archive · AI-enriched for research
- Published
- Category
- Bid Notice
- City
- Marion
Research context
What to do next
- 1
Prepare Your Bid
Ensure your bid is ready for submission by the deadline of May 14, 2026.
- 2
Obtain Bid Documents
Visit the County Engineer's office to collect bid documents before submitting your bid.
- 3
Attend Bid Opening
Join the public bid opening on May 14, 2026, at 9:30 a.m. at the office.
Frequently asked questions
- What is the deadline for submitting bids?
- Bids must be submitted by May 14, 2026, at 9:30 a.m.
- Where can I obtain bid documents?
- Bid documents can be obtained at the Commissioner's Office at the provided address.
- When will the bids be opened?
- Bids will be opened immediately after the submission deadline on May 14, 2026.
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Full Notice Text
ADVERTISEMENT NOTICE TO BIDDERS Sealed bids may be submitted on or before the bid opening date of May 14, 2026, at 9:30 a.m. local time, at the Commissioner's Office, 222 West Center St. Marion, OH 43302 for the following Project: 2026 Chip Seal Program. Bids shall be opened and bid prices publicly read immediately thereafter. Bid Documents, including contract terms and conditions, may be obtained at no cost from the County Engineer, at the address provided above, between the hours of 8:30 a.m. – 4:30 p.m., Monday through Friday (holidays excluded). COUNTY OF MARION Bradley K. Irons, P.E., P.S. Marion County Engineer ENGINEER'S ESTIMATE: $633,375.80 MS,APR28MAY5,'26#12278926